TTMI News & Events

TTM Technologies announced the grand opening of its new Ultra-High-Density Interconnect printed circuit board manufacturing facility in Syracuse, New York. The new facility, spanning 215,000 square feet on TTM's existing Syracuse campus, is among the first in the nation to be purpose-built for Ultra-HDI PCB and advanced packaging production, serving aerospace and defense programs. The investment will create up to 400 new engineering and manufacturing jobs, bringing TTM's total Central New York workforce to approximately 1,000 employees. Contributing to the total investment in Syracuse, the project received a $30M investment from the U.S. Department of War.

TTM Technologies announced the intent to acquire, subject to regulatory approvals, two well established companies in Europe: privately-held Swiss Technology Group AG, headquartered in Zurich, Switzerland, and privately-held ILFA GmbH, headquartered in Hannover, Germany, in separate transactions for all-cash consideration.